EYG-S0811ZLWG Harga (USD) [6370pcs Stock]
- 1 pcs$6.46948
- 10 pcs$6.11031
- 25 pcs$5.75113
- 50 pcs$5.39161
- 100 pcs$5.03218
- 250 pcs$4.67272
- 500 pcs$4.58287
- Nombor Bahagian:
- EYG-S0811ZLWG
- Pengeluar:
- Panasonic Electronic Components
- Penerangan terperinci:
- THERM PAD 108MMX78MM GRAY. Thermal Interface Products Soft PGS - IGBT Mod Mitsubishi Elec.
- Masa peneraju standard pengeluar:
- Dalam stok
- Jangka hayat:
- Setahun
- Chip Dari:
- Hong Kong
- RoHS:
- Kaedah pembayaran:
-
- Cara penghantaran:
- Kategori Keluarga:
- KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
- Kelebihan daya saing:
- We specialize in Panasonic Electronic Components EYG-S0811ZLWG electronic components. EYG-S0811ZLWG can be shipped within 24 hours after order. If you have any demands for EYG-S0811ZLWG, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
EYG-S0811ZLWG Atribut Produk
Nombor Bahagian :
EYG-S0811ZLWG
Pengeluar :
Panasonic Electronic Components
Penerangan :
THERM PAD 108MMX78MM GRAY
Siri :
Soft-PGS
Status Bahagian :
Active
Penggunaan :
IGBT - Heat Transfer Low Thermal Resistance
Taipkan :
Graphite-Pad, Sheet
Bentuk :
Rectangular
Garis Besar :
108.00mm x 78.00mm
Ketebalan :
0.0079" (0.200mm)
Bahan :
Graphite
Pelekat :
-
Backing, Carrier :
-
Warna :
Gray
Resistivity terma :
-
Kekonduksian terma :
20 W/m-K
Berita terkini
Anda Juga Boleh Berminat Dalam
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-220-N
Wakefield-Vette
THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole
-
CD-02-05-C-22
Wakefield-Vette
THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
Bahagian panas
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- A14162-26
- DC0040/03-PC99-0.06
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- DC0038/02-PC99-0.06
- DC0037/03-PC99AL-0.1
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