ATS-61325R-C1-R0 Harga (USD) [6622pcs Stock]
- 1 pcs$5.57045
- 10 pcs$5.30559
- 25 pcs$4.97409
- 50 pcs$4.80830
- 100 pcs$4.41035
- 250 pcs$4.14507
- 500 pcs$4.06216
- 1,000 pcs$4.04558
- Nombor Bahagian:
- ATS-61325R-C1-R0
- Pengeluar:
- Advanced Thermal Solutions Inc.
- Penerangan terperinci:
- MAXIGRIP FANSINK 32.5X19.5MM. Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 31.75x31.75x19.5mm, 31.75mm dia.
- Masa peneraju standard pengeluar:
- Dalam stok
- Jangka hayat:
- Setahun
- Chip Dari:
- Hong Kong
- RoHS:
- Kaedah pembayaran:
-
- Cara penghantaran:
- Kategori Keluarga:
- KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
- Kelebihan daya saing:
- We specialize in Advanced Thermal Solutions Inc. ATS-61325R-C1-R0 electronic components. ATS-61325R-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-61325R-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-61325R-C1-R0 Atribut Produk
Nombor Bahagian :
ATS-61325R-C1-R0
Pengeluar :
Advanced Thermal Solutions Inc.
Penerangan :
MAXIGRIP FANSINK 32.5X19.5MM
Siri :
fanSINK, maxiGRIP
Status Bahagian :
Active
Taipkan :
Top Mount
Pakej Dingin :
BGA
Kaedah Lampiran :
Clip, Thermal Material
Bentuk :
Square, Pin Fins
Panjang :
1.279" (32.50mm)
Lebar :
1.279" (32.50mm)
Diameter :
-
Ketinggian Base (Ketinggian Fin) :
0.768" (19.50mm)
Pengasingan Kuasa @ Suhu Meningkat :
-
Rintangan Termal @ Aliran Udara Paksa :
1.80°C/W @ 200 LFM
Rintangan Thermal @ Natural :
-
Bahan :
Aluminum
Selesai Bahan :
Black Anodized
Berita terkini
Anda Juga Boleh Berminat Dalam
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
-
-
Bahagian panas
- LATO3B4B
- 565415-01
- 565019-01
- FEX35-35-21/T710/M2
- DA-T268-301E
- 4-1542005-5
- 7-1542004-0
- 8-1542003-7
- 574802B03700G
- VHS-95
- MHST02525
- MHSL05025
- MHSL05040
- APR38-38-12CB
- 7-438-X44-BA
- 243-3PAB
- LA363B5CB
- LA363B4CB
- 7-406-000-BA
- 7-300-000-BA
- 7-192-BA
- 2-1963559-7
- 2-1963562-3
- 2-1963556-7
- 2-1963559-2
- 1-1963558-2
- 2-1963555-2
- 1-1963555-2
- 2-1963557-5
- 1-1963559-5
- 2-1963553-4
- 2-1963555-3
- 2-1963551-3
- 1-1963553-3
- 5-1542006-7
- 39880100030
- 39880100110
- 39880100060
- 39880100040
- 7-1542006-0