Bergquist - GPHC3.0-0.080-02-0816

KEY Part #: K6153174

GPHC3.0-0.080-02-0816 Harga (USD) [849pcs Stock]

  • 1 pcs$54.96296
  • 4 pcs$54.68951

Nombor Bahagian:
GPHC3.0-0.080-02-0816
Pengeluar:
Bergquist
Penerangan terperinci:
THERM PAD 406.4MMX203.2MM BLUE. Thermal Interface Products BERGQUIST GAP PAD TGP HC3000
Masa peneraju standard pengeluar:
Dalam stok
Jangka hayat:
Setahun
Chip Dari:
Hong Kong
RoHS:
Kaedah pembayaran:
Cara penghantaran:
Kategori Keluarga:
KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
Kelebihan daya saing:
We specialize in Bergquist GPHC3.0-0.080-02-0816 electronic components. GPHC3.0-0.080-02-0816 can be shipped within 24 hours after order. If you have any demands for GPHC3.0-0.080-02-0816, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

GPHC3.0-0.080-02-0816 Atribut Produk

Nombor Bahagian : GPHC3.0-0.080-02-0816
Pengeluar : Bergquist
Penerangan : THERM PAD 406.4MMX203.2MM BLUE
Siri : Gap Pad® HC 3.0
Status Bahagian : Active
Penggunaan : -
Taipkan : Pad, Sheet
Bentuk : Rectangular
Garis Besar : 406.40mm x 203.20mm
Ketebalan : 0.0800" (2.032mm)
Bahan : -
Pelekat : Tacky - Both Sides
Backing, Carrier : Fiberglass
Warna : Blue
Resistivity terma : -
Kekonduksian terma : 3.0 W/m-K

Anda Juga Boleh Berminat Dalam
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft