Nombor Bahagian :
HF115AC-0.0055-AC-105
Penerangan :
THERM PAD 36.83MMX21.29MM W/ADH
Garis Besar :
36.83mm x 21.29mm
Ketebalan :
0.0055" (0.140mm)
Bahan :
Phase Change Compound
Pelekat :
Adhesive - One Side
Backing, Carrier :
Fiberglass
Resistivity terma :
0.35°C/W
Kekonduksian terma :
0.8 W/m-K