CTS Thermal Management Products - BDN09-3CB

KEY Part #: K6265475

BDN09-3CB Harga (USD) [48708pcs Stock]

  • 1 pcs$0.71077
  • 10 pcs$0.67523
  • 25 pcs$0.65742
  • 50 pcs$0.63969
  • 100 pcs$0.60415
  • 250 pcs$0.56862
  • 500 pcs$0.53308
  • 1,000 pcs$0.49754
  • 5,000 pcs$0.47977

Nombor Bahagian:
BDN09-3CB
Pengeluar:
CTS Thermal Management Products
Penerangan terperinci:
HEATSINK CPU .91 SQ.
Masa peneraju standard pengeluar:
Dalam stok
Jangka hayat:
Setahun
Chip Dari:
Hong Kong
RoHS:
Kaedah pembayaran:
Cara penghantaran:
Kategori Keluarga:
KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
Kelebihan daya saing:
We specialize in CTS Thermal Management Products BDN09-3CB electronic components. BDN09-3CB can be shipped within 24 hours after order. If you have any demands for BDN09-3CB, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BDN09-3CB Atribut Produk

Nombor Bahagian : BDN09-3CB
Pengeluar : CTS Thermal Management Products
Penerangan : HEATSINK CPU .91 SQ
Siri : BDN
Status Bahagian : Active
Taipkan : Top Mount
Pakej Dingin : Assorted (BGA, LGA, CPU, ASIC...)
Kaedah Lampiran : Thermal Tape, Adhesive (Not Included)
Bentuk : Square, Pin Fins
Panjang : 0.910" (23.11mm)
Lebar : 0.910" (23.11mm)
Diameter : -
Ketinggian Base (Ketinggian Fin) : 0.355" (9.02mm)
Pengasingan Kuasa @ Suhu Meningkat : -
Rintangan Termal @ Aliran Udara Paksa : 9.60°C/W @ 400 LFM
Rintangan Thermal @ Natural : 26.90°C/W
Bahan : Aluminum
Selesai Bahan : Black Anodized

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