HEAT SINK TO-3 .500 COMPACT. Heat Sinks Diamond Shaped Basket Stamped Heatsink for TO-3, Low-Cost, Horizontal Mounting, 12 n Thermal Resistance, Black Anodized, 12.7mm
Masa peneraju standard pengeluar:
Dalam stok
Jangka hayat:
Setahun
Chip Dari:
Hong Kong
RoHS:
Kaedah pembayaran:
Cara penghantaran:
Kategori Keluarga:
KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
Kelebihan daya saing:
We specialize in Aavid, Thermal Division of Boyd Corporation 501303B00000G electronic components. 501303B00000G can be shipped within 24 hours after order. If you have any demands for 501303B00000G, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
501303B00000G Atribut Produk
Nombor Bahagian :501303B00000G
Pengeluar :Aavid, Thermal Division of Boyd Corporation
Penerangan :HEAT SINK TO-3 .500 COMPACT
Siri :-
Status Bahagian :Active
Taipkan :Board Level
Pakej Dingin :TO-3
Kaedah Lampiran :Bolt On
Bentuk :Rhombus
Panjang :1.880" (47.75mm)
Lebar :1.400" (35.56mm)
Diameter :-
Ketinggian Base (Ketinggian Fin) :0.500" (12.70mm)
Pengasingan Kuasa @ Suhu Meningkat :2.0W @ 30°C
Rintangan Termal @ Aliran Udara Paksa :4.00°C/W @ 300 LFM