[8725pcs Stock]
- Nombor Bahagian:
- APF19-19-13CB
- Pengeluar:
- CTS Thermal Management Products
- Penerangan terperinci:
- HEATSINK LOW-PROFILE FORGED.
- Masa peneraju standard pengeluar:
- Dalam stok
- Jangka hayat:
- Setahun
- Chip Dari:
- Hong Kong
- RoHS:
- Kaedah pembayaran:
-
- Cara penghantaran:
- Kategori Keluarga:
- KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
- Kelebihan daya saing:
- We specialize in CTS Thermal Management Products APF19-19-13CB electronic components. APF19-19-13CB can be shipped within 24 hours after order. If you have any demands for APF19-19-13CB, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
APF19-19-13CB Atribut Produk
Nombor Bahagian :
APF19-19-13CB
Pengeluar :
CTS Thermal Management Products
Penerangan :
HEATSINK LOW-PROFILE FORGED
Siri :
APF
Status Bahagian :
Active
Taipkan :
Top Mount
Pakej Dingin :
Assorted (BGA, LGA, CPU, ASIC...)
Kaedah Lampiran :
Thermal Tape, Adhesive (Not Included)
Bentuk :
Square, Fins
Panjang :
0.748" (19.00mm)
Lebar :
0.748" (19.00mm)
Diameter :
-
Ketinggian Base (Ketinggian Fin) :
0.500" (12.70mm)
Pengasingan Kuasa @ Suhu Meningkat :
-
Rintangan Termal @ Aliran Udara Paksa :
4.00°C/W @ 200 LFM
Rintangan Thermal @ Natural :
-
Bahan :
Aluminum
Selesai Bahan :
Black Anodized
Berita terkini
Anda Juga Boleh Berminat Dalam
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WAVE-23-125
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ANCHOR HEATSINK 23X23X12.5MM. Heat Sinks Wave Series Low Profile Heatsink BGA Chipset Aluminum Top Mount, 23x23x12.5mm
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