QII-0.006-00-54 Harga (USD) [137531pcs Stock]
- 1 pcs$0.26894
- 10 pcs$0.24086
- 50 pcs$0.21594
- 100 pcs$0.19103
- 500 pcs$0.16611
- 1,000 pcs$0.12458
- 5,000 pcs$0.10797
- Nombor Bahagian:
- QII-0.006-00-54
- Pengeluar:
- Bergquist
- Penerangan terperinci:
- THERM PAD 19.05MMX12.7MM BLACK. Thermal Interface Products Foil-Format Grease Replacement for Maximum Heat Transfer, 0.006" Thickness, Sil-Pad TSP Q2500 Series / Also Known as Bergquist Q-Pad II Series, Q2-54, BG40256, 2188993
- Masa peneraju standard pengeluar:
- Dalam stok
- Jangka hayat:
- Setahun
- Chip Dari:
- Hong Kong
- RoHS:
- Kaedah pembayaran:
-
- Cara penghantaran:
- Kategori Keluarga:
- KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
- Kelebihan daya saing:
- We specialize in Bergquist QII-0.006-00-54 electronic components. QII-0.006-00-54 can be shipped within 24 hours after order. If you have any demands for QII-0.006-00-54, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
QII-0.006-00-54 Atribut Produk
Nombor Bahagian :
QII-0.006-00-54
Pengeluar :
Bergquist
Penerangan :
THERM PAD 19.05MMX12.7MM BLACK
Siri :
Q-Pad® II
Status Bahagian :
Active
Penggunaan :
TO-220
Taipkan :
Pad, Sheet
Bentuk :
Rectangular
Garis Besar :
19.05mm x 12.70mm
Ketebalan :
0.0060" (0.152mm)
Bahan :
Sil-Pad Rubber, Aluminum Coated
Pelekat :
-
Backing, Carrier :
-
Warna :
Black
Resistivity terma :
0.22°C/W
Kekonduksian terma :
2.5 W/m-K
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