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Sekiranya lokasi anda tidak disenaraikan, sila pilih salah satu daripada yang berikut:

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  1. Rumah
  2. Produk
  3. Fans, Thermal Management
  4. Thermal - Pads, Sheets
  5. A15896-06

Laird Technologies - Thermal Materials - A15896-06

KEY Part #: K6153152

A15896-06 Harga (USD) [741pcs Stock]

  • 1 pcs$62.67561
  • 3 pcs$59.69549
Nombor Bahagian:
A15896-06
Pengeluar:
Laird Technologies - Thermal Materials
Penerangan terperinci:
THERM PAD 228.6MMX228.6MM GRAY. Thermal Interface Products Tflex 760 9x9" 5.0W/mK gap filler
Masa peneraju standard pengeluar:
Dalam stok
Jangka hayat:
Setahun
Chip Dari:
Hong Kong
RoHS:
Kaedah pembayaran:
Cara penghantaran:
Kategori Keluarga:
KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
Kelebihan daya saing:
We specialize in Laird Technologies - Thermal Materials A15896-06 electronic components. A15896-06 can be shipped within 24 hours after order. If you have any demands for A15896-06, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A15896-06 Atribut Produk

Nombor Bahagian : A15896-06
Pengeluar : Laird Technologies - Thermal Materials
Penerangan : THERM PAD 228.6MMX228.6MM GRAY
Siri : Tflex™ 700
Status Bahagian : Not For New Designs
Penggunaan : -
Taipkan : Gap Filler Pad, Sheet
Bentuk : Square
Garis Besar : 228.60mm x 228.60mm
Ketebalan : 0.0600" (1.524mm)
Bahan : Silicone
Pelekat : Tacky - Both Sides
Backing, Carrier : -
Warna : Gray
Resistivity terma : -
Kekonduksian terma : 5.0 W/m-K

Berita terkini

Laird Performance Materials CoolZorb 600 Hybrid Thermal/EMI Absorbers
Laird Performance Materials CoolZorb 500 Hybrid Thermal/EMI Absorbers
Laird Performance Materials CoolZorb Hybrid Thermal EMI Absorbers
Laird Performance Materials CoolZorb 400 Hybrid Thermal Transfer/EMI Absorber
Anda Juga Boleh Berminat Dalam
  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-22

    Wakefield-Vette

    THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

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