t-Global Technology - T62-30-30-0.13

KEY Part #: K6153151

T62-30-30-0.13 Harga (USD) [406614pcs Stock]

  • 1 pcs$0.09096
  • 10 pcs$0.08543
  • 25 pcs$0.08131
  • 50 pcs$0.07910
  • 100 pcs$0.07807
  • 250 pcs$0.07272
  • 500 pcs$0.06845
  • 1,000 pcs$0.06203
  • 5,000 pcs$0.05989

Nombor Bahagian:
T62-30-30-0.13
Pengeluar:
t-Global Technology
Penerangan terperinci:
THERM PAD 30MMX30MM BLACK.
Masa peneraju standard pengeluar:
Dalam stok
Jangka hayat:
Setahun
Chip Dari:
Hong Kong
RoHS:
Kaedah pembayaran:
Cara penghantaran:
Kategori Keluarga:
KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
Kelebihan daya saing:
We specialize in t-Global Technology T62-30-30-0.13 electronic components. T62-30-30-0.13 can be shipped within 24 hours after order. If you have any demands for T62-30-30-0.13, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

T62-30-30-0.13 Atribut Produk

Nombor Bahagian : T62-30-30-0.13
Pengeluar : t-Global Technology
Penerangan : THERM PAD 30MMX30MM BLACK
Siri : T62
Status Bahagian : Active
Penggunaan : -
Taipkan : Graphite-Pad, Sheet
Bentuk : Square
Garis Besar : 30.00mm x 30.00mm
Ketebalan : 0.0050" (0.127mm)
Bahan : Graphite
Pelekat : -
Backing, Carrier : -
Warna : Black
Resistivity terma : -
Kekonduksian terma : 20 W/m-K

Anda Juga Boleh Berminat Dalam
  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-22

    Wakefield-Vette

    THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole