3M (TC) - 5590H-TO3

KEY Part #: K6153156

5590H-TO3 Harga (USD) [58817pcs Stock]

  • 1 pcs$0.57280
  • 10 pcs$0.54562
  • 25 pcs$0.53115
  • 100 pcs$0.48809
  • 250 pcs$0.45937
  • 500 pcs$0.43067
  • 1,000 pcs$0.40195

Nombor Bahagian:
5590H-TO3
Pengeluar:
3M (TC)
Penerangan terperinci:
THERM PAD 41.91MMX28.96MM GRAY.
Masa peneraju standard pengeluar:
Dalam stok
Jangka hayat:
Setahun
Chip Dari:
Hong Kong
RoHS:
Kaedah pembayaran:
Cara penghantaran:
Kategori Keluarga:
KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
Kelebihan daya saing:
We specialize in 3M (TC) 5590H-TO3 electronic components. 5590H-TO3 can be shipped within 24 hours after order. If you have any demands for 5590H-TO3, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

5590H-TO3 Atribut Produk

Nombor Bahagian : 5590H-TO3
Pengeluar : 3M (TC)
Penerangan : THERM PAD 41.91MMX28.96MM GRAY
Siri : 5590H
Status Bahagian : Active
Penggunaan : TO-3
Taipkan : Interface Pad, Sheet
Bentuk : Rhombus
Garis Besar : 41.91mm x 28.96mm
Ketebalan : 0.0197" (0.500mm)
Bahan : Acrylic Elastomer
Pelekat : Tacky - Both Sides
Backing, Carrier : -
Warna : Gray
Resistivity terma : 0.46°C/W
Kekonduksian terma : 3.0 W/m-K

Anda Juga Boleh Berminat Dalam
  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-22

    Wakefield-Vette

    THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole