DC0011/08-TI900-0.12-2A Harga (USD) [239798pcs Stock]
- 1 pcs$0.15424
- 10 pcs$0.14792
- 25 pcs$0.14064
- 50 pcs$0.13700
- 100 pcs$0.13510
- 250 pcs$0.12586
- 500 pcs$0.11846
- 1,000 pcs$0.10735
- 5,000 pcs$0.10365
- Nombor Bahagian:
- DC0011/08-TI900-0.12-2A
- Pengeluar:
- t-Global Technology
- Penerangan terperinci:
- THERM PAD 19.05MMX12.7MM W/ADH.
- Masa peneraju standard pengeluar:
- Dalam stok
- Jangka hayat:
- Setahun
- Chip Dari:
- Hong Kong
- RoHS:
- Kaedah pembayaran:
-
- Cara penghantaran:
- Kategori Keluarga:
- KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
- Kelebihan daya saing:
- We specialize in t-Global Technology DC0011/08-TI900-0.12-2A electronic components. DC0011/08-TI900-0.12-2A can be shipped within 24 hours after order. If you have any demands for DC0011/08-TI900-0.12-2A, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
DC0011/08-TI900-0.12-2A Atribut Produk
Nombor Bahagian :
DC0011/08-TI900-0.12-2A
Pengeluar :
t-Global Technology
Penerangan :
THERM PAD 19.05MMX12.7MM W/ADH
Siri :
Ti900
Status Bahagian :
Active
Penggunaan :
TO-220
Taipkan :
Die-Cut Pad, Sheet
Bentuk :
Rectangular
Garis Besar :
19.05mm x 12.70mm
Ketebalan :
0.0050" (0.127mm)
Bahan :
Silicone
Pelekat :
Adhesive - Both Sides
Backing, Carrier :
Viscose
Warna :
White
Resistivity terma :
-
Kekonduksian terma :
1.8 W/m-K
Berita terkini
Anda Juga Boleh Berminat Dalam
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Bahagian panas
- A14563-02
- A14573-01
- A14950-17
- GPHC3.0-0.100-02-0816
- A14568-01
- A14950-10
- A14950-08
- A14950-05
- GP3500ULM--0.020-12-0816
- A14950-03
- T69-295-295-0.040-1A
- 5519S 210 MM X 155 MM X 1.0 MM
- A14162-26
- DC0040/03-PC99-0.06
- DC0040/11-PC99AL-0.1
- DC0038/02-PC99-0.06
- DC0037/03-PC99AL-0.1
- DC0037/01-PC99-0.06
- DC0036/04-PC99-0.06
- DC0038/02-PC99AL-0.1
- DC0041/04-PC99AL-0.1
- DC0038/04-PC99-0.06
- TG4040S-320-320-3.0-0
- TG4040S-150-150-2.0-0
- TG4040S-100-100-3.0-0
- TG4040S-300-300-5.0-0
- PC93-150-150-0.25-0
- PC99-300-300-0.06-0
- A15673-08
- A16364-07
- A15641-15
- A14162-27
- 5591S 210 MM X 300 MM 2.0 MM
- CPU 1.375X1.375
- DC0040/09-PC99AL-0.1
- DC0040/05-PC99-0.06
- GPVOU-0.100-01-0816
- SPK10-0.006-00-48
- SP400-0.009-00-22
- Q3-0.005-00-11