Q3-0.005-00-67 Harga (USD) [283397pcs Stock]
- 1 pcs$0.17797
- 10 pcs$0.15701
- 50 pcs$0.14088
- 100 pcs$0.12462
- 500 pcs$0.10837
- 1,000 pcs$0.08128
- 5,000 pcs$0.07044
- Nombor Bahagian:
- Q3-0.005-00-67
- Pengeluar:
- Bergquist
- Penerangan terperinci:
- THERM PAD 38.1MMX22.86MM BLACK. Thermal Interface Products Glass-Reinforced Grease Replacement Thermal Interface, 0.005" Thickness, 1.5x0.9x0.150x1.20", Sil-Pad TSP Q2000 Series / Also Known as Bergquist Q-Pad 3 Series
- Masa peneraju standard pengeluar:
- Dalam stok
- Jangka hayat:
- Setahun
- Chip Dari:
- Hong Kong
- RoHS:
- Kaedah pembayaran:
-
- Cara penghantaran:
- Kategori Keluarga:
- KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
- Kelebihan daya saing:
- We specialize in Bergquist Q3-0.005-00-67 electronic components. Q3-0.005-00-67 can be shipped within 24 hours after order. If you have any demands for Q3-0.005-00-67, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
Q3-0.005-00-67 Atribut Produk
Nombor Bahagian :
Q3-0.005-00-67
Pengeluar :
Bergquist
Penerangan :
THERM PAD 38.1MMX22.86MM BLACK
Siri :
Q-Pad® 3
Status Bahagian :
Active
Penggunaan :
Power Module
Taipkan :
Pad, Sheet
Bentuk :
Rectangular
Garis Besar :
38.10mm x 22.86mm
Ketebalan :
0.0050" (0.127mm)
Bahan :
Elastomer
Pelekat :
-
Backing, Carrier :
Fiberglass
Warna :
Black
Resistivity terma :
0.35°C/W
Kekonduksian terma :
2.0 W/m-K
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