Bergquist - SP900S-0.009-AC-58

KEY Part #: K6151079

SP900S-0.009-AC-58 Harga (USD) [406614pcs Stock]

  • 1 pcs$0.09096
  • 10 pcs$0.08266
  • 50 pcs$0.07404
  • 100 pcs$0.06549
  • 500 pcs$0.05695
  • 1,000 pcs$0.04271
  • 5,000 pcs$0.03702

Nombor Bahagian:
SP900S-0.009-AC-58
Pengeluar:
Bergquist
Penerangan terperinci:
THERM PAD 19.05MMX12.7MM W/ADH. Thermal Interface Products High Performance Insulator for Low-Pressure Applications, 0.009" Thickness, Adhesive - One Side, 19.05x12.70x4.75x3.73mm, Sil-Pad TSP 1600S Series / Also Known as Bergq
Masa peneraju standard pengeluar:
Dalam stok
Jangka hayat:
Setahun
Chip Dari:
Hong Kong
RoHS:
Kaedah pembayaran:
Cara penghantaran:
Kategori Keluarga:
KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
Kelebihan daya saing:
We specialize in Bergquist SP900S-0.009-AC-58 electronic components. SP900S-0.009-AC-58 can be shipped within 24 hours after order. If you have any demands for SP900S-0.009-AC-58, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

SP900S-0.009-AC-58 Atribut Produk

Nombor Bahagian : SP900S-0.009-AC-58
Pengeluar : Bergquist
Penerangan : THERM PAD 19.05MMX12.7MM W/ADH
Siri : Sil-Pad® 900-S
Status Bahagian : Active
Penggunaan : TO-220
Taipkan : Pad, Sheet
Bentuk : Rectangular
Garis Besar : 19.05mm x 12.70mm
Ketebalan : 0.0090" (0.229mm)
Bahan : Silicone Rubber
Pelekat : Adhesive - One Side
Backing, Carrier : Fiberglass
Warna : Pink
Resistivity terma : 0.61°C/W
Kekonduksian terma : 1.6 W/m-K