CD-02-05-DO4 Harga (USD) [146126pcs Stock]
- 1 pcs$0.25312
- Nombor Bahagian:
- CD-02-05-DO4
- Pengeluar:
- Wakefield-Vette
- Penerangan terperinci:
- THERM PAD DO-4 0.625OD/0.203ID. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, DO-4 Pad, 0.625 Inch OD / 0.203 Inch ID
- Masa peneraju standard pengeluar:
- Dalam stok
- Jangka hayat:
- Setahun
- Chip Dari:
- Hong Kong
- RoHS:
- Kaedah pembayaran:
-
- Cara penghantaran:
- Kategori Keluarga:
- KEY Components Co., LTD adalah Pengedar Komponen Elektronik yang menawarkan kategori produk termasuk: ...
- Kelebihan daya saing:
- We specialize in Wakefield-Vette CD-02-05-DO4 electronic components. CD-02-05-DO4 can be shipped within 24 hours after order. If you have any demands for CD-02-05-DO4, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
CD-02-05-DO4 Atribut Produk
Nombor Bahagian :
CD-02-05-DO4
Pengeluar :
Wakefield-Vette
Penerangan :
THERM PAD DO-4 0.625OD/0.203ID
Siri :
ulTIMiFlux™
Status Bahagian :
Active
Penggunaan :
DO-4
Taipkan :
Pad, Sheet
Bentuk :
Round
Garis Besar :
15.88mm Dia
Ketebalan :
0.0030" (0.076mm)
Bahan :
Phase Change Compound
Pelekat :
-
Backing, Carrier :
Polyimide
Warna :
Orange
Resistivity terma :
-
Kekonduksian terma :
-
Berita terkini
Anda Juga Boleh Berminat Dalam
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THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
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CD-02-05-126
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THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
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CD-02-05-220
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THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick
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THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole
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CD-02-05-C-22
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THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole
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CD-02-05-C-20
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THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
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